The Intevac Matrix® platform’s high-speed transport technology improves productivity to over 3,000 wafers per hour, depending on the application. The platform’s overhead carrier return greatly minimizes the system’s overall footprint. Multiple load locks allow independent control of process chambers.
- Range of PVD sources and technology – direct current (DC) and radio frequency (RF), including reactive ion deposition
- Flexible handling to accommodate different substrate shapes and sizes
- LSMA source technology enables high target utilization and reduces cost of ownership
- Integrated inverter system for double-sided coatings
Edge exclusion masking
The precision masking capability of the Intevac Matrix platform provides single-sided deposition without metal wrap to the back and the sides of the wafer, thus avoiding additional wet etch steps.