Integrating Intevac’s advanced deposition and substrate handling technologies, the MATRIX® PVD System is a uniquely versatile platform for thin-film processing. The system aims at serving advanced packaging needs on a variety of substrate materials and on any shape and size up to 890 mm wide.

Key Benefits

  • Substrate-agnostic: Wafers, Panels, Strips, etc. -all compatible
  • Neutral ion beam etching for highly effective and damage-free pre-clean
  • Linear Scanning Magnet Array (LSMA) magnetron deposition sources from significantly higher target utilizations compared to static planar magnetrons

Target Usage Comparison

Static (Planar) Magnetron

25-45% Efficiency

Source: Materials Science, Inc.

Intevac LSMA

>65% Efficiency

The MATRIX® PVD System utilizes an in-line carrier-based transport system for the highest throughput. The system can accommodate multiple thin film deposition technologies, including PVD and CVD. The platform can also be configured with Intevac’s proprietary ion beam etch (IBE) module which produces a net electrically neutral beam for substrate surface preparation.