Intevac’s solutions in advanced thin-film processing provide compelling advantages for outsourced semiconductor assembly and test (OSAT) manufacturers over current packaging processes. The key advantage of the MATRIX PVD System is that it delivers low-contact resistance (Rc) because of integrated and tightly controlled net neutral ion beam pre-clean and sequential processing. Additionally, the system’s high throughput reduces the cost of the redistribution layer (RDL) in fan-out wafer-level packaging (FOWLP) and fan-out panel-level packaging (FOPLP).
- Carrier-based design allows an effortless migration path for OSATs to move between wafer-level and panel-level processing; no process chamber modifications necessary.
- Superior process metrics including high film uniformity over large areas and industry-leading Rc.
- Significantly faster throughput and smaller footprint than cluster tools.
The typical RDL process sequence of the Matrix PVD System consists of the following steps: Degas, pre-clean, PVD Ti and PVD Cu. Ti and Cu film uniformity, sheet resistance and adhesion meet industry requirements. Cost of ownership is considerably less with the Matrix PVD System compared to cluster tools for RDL barrier and seed layers in fan-out packaging.