The MATRIX™ PVD System is a substrate-independent platform for multiple thin film applications in semiconductor packaging. From its modular design to its automated linear transport, every aspect in the design of the MATRIX PVD System aims at maximizing productivity and minimizing cost of ownership.


Application


Fan-Out Packaging and UBM

Learn about the process and productivity advantages that Intevac offers for advanced semiconductor packaging.


Platform


MATRIX™ PVD System for Advanced Packaging

One platform to process a variety of barrier/seed layer films in fan-out redistribution layer (RDL) and under bump metallization (UBM) applications, the MATRIX PVD System leverages Intevac’s core capabilities in precise thin film technologies.