The MATRIX® PVD System is a substrate-independent platform for multiple thin film applications in semiconductor packaging. From its modular design to its automated linear transport, every aspect in the design of the MATRIX® PVD System aims at maximizing productivity and minimizing cost of ownership.


Fan-Out Packaging and UBM

Learn about the process and productivity advantages that Intevac offers for advanced semiconductor packaging.


MATRIX™ PVD System for Advanced Packaging

One platform to process a variety of barrier/seed layer films in fan-out redistribution layer (RDL) and under bump metallization (UBM) applications, the MATRIX PVD System leverages Intevac’s core capabilities in precise thin film technologies.