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The Intevac Matrix® platform’s high-speed transport technology improves productivity to over 3,000 wafers per hour, depending on the application. The platform’s overhead carrier return greatly minimizes the system’s overall footprint. Multiple load locks allow independent control of process chambers. Key … Read more

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Intevac’s solutions in advanced thin-film processing provide compelling advantages for outsourced semiconductor assembly and test (OSAT) manufacturers over current packaging processes. The key advantage of the MATRIX® PVD System is that it delivers low-contact resistance (R­c) because of integrated and … Read more

Add Personality to the Smartphone Optically-engineered, multi-layer film stacks unlock a virtually limitless range of colors, gradients and patterned effects for back cover glass. Intevac’s Non-Conductive Vacuum Metallization (NCVM) technologies expand the design freedom of the next generation of smartphones. … Read more

Cover glass on smart devices has improved in toughness, but it has not advanced in scratch and abrasion resistance. Intevac’s new DiamondClad™ technology, an optically clear diamond-like carbon coating, is the premier scratch and abrasion protection solution for today’s and … Read more