Universal Source

High efficiency, rotating magnetron assembly achieves reduced cost / disk through high target utilization and full surface erosion. Benefits:

• More disks coated per target
• Fewer target replacement cycles per week
• Minimal target material waste

Rotation Station

Designed for glass disk processing. The rotation station provides full metal coverage on the disk by rotating about 10° between metal sputter steps. Glass disks are then ensured 100% metal coverage and can be followed with process steps including bias.

NCT Carbon Deposition Source

Source for ultra-thin (<20 °A), high-density carbon overcoat offers excellent corrosion resistance and low particle performance.

Carrier Exchange

Increases overall system availability by providing a chamber, which enables exchange of carriers under vacuum conditions. The carrier exchange is an integrated chamber with a dedicated vacuum system and can store up to 32 carriers. Carriers can be replaced in approximately 30 minutes without a need to shut down the entire system.

Halo Etch™ Source

High rate planar etch source fully compatible with the 200 Lean Gen II platform for use in producing patterned media. It is a capacitive coupled plasma etch source capable of etching patterned disks to support the high throughputs associated with the 200 Lean platform. The source may be used with inert or reactive gases.

High Temperature Heater

Enhanced heating source capable of providing high rate of heating at processing temperatures of 650° C with exceptional uniformity, which is important for the production of advanced magnetic thin film stacks for use in ultra high density recording applications.

Dynamic Cooling Source (DCS)

Evolved from earlier cooling sources, this source provides higher cooling rates than previously achieved which are required to rapidly reduce the temperature of thin film stacks produced at much higher process temperatures for advanced media applications.

Triatron Source

Deposition source capable of independently depositing up to three different materials in the same process chamber simultaneously or sequentially, and can sputter from one or more of its three concentric rings of material. Most applicable for R&D activities where the study of various material composition ratios is required to select optimum performing magnetic thin film materials.

Multi-Layer Source (MLS)

Similar to the Triatron source, is capable of deposition of up to three different materials but operates in a pass by mode, and is more suited to actual manufacturing of multi-layer magnetic stack media with high throughput, excellent uniformity and low material usage. Materials are deposited from bars of material that are adjacent to each other as opposed to concentric rings.

Radio Frequency (RF) Source

Operates at radio frequency and is most suitable for deposition of non-metallic (insulating) or high resistivity metal targets that may be used in advanced media applications.