Intevac's Lean Etch is the first ever wafer processing system built with lean principles. The Lean Etch system's unique parallel architecture utilizes two sets of twin linear robots to replace the large, central handler commonly found on all cluster tools. The linear platform not only eliminates dependency on a single, central handler but also enables faster wafer transport and higher space utilization. In addition, a wide, central service aisle significantly eases serviceability by providing 360 degree access to the mainframe and chamber backside. Designed for manufacturability, the Lean Etch has a modular design that facilitates production ramp-ups at minimum cost. The design allows for both single sided (3 chamber) and dual sided configurations (6 chamber), for higher availability, and superior productivity. The system's compact footprint and high throughput effectively optimizes clean room space and reduces total cost of ownership.
The Lean Etch chamber offers advanced capabilities for dielectric etch applications. The combination of unique T-source design with instant-on technology and pulsing capability enables superior etch process control, a large process window, higher etch rates, a continuous vertical profile and high PR selectivity.
For more information email leanetch@intevac.com
