Intevac’s Lean Platform brings true innovation to semiconductor equipment design, and efficiency and productivity benefits to our customers. As design node and wafer size changes become increasingly expensive, current equipment design significantly contributes to these costs. Intevac’s revolutionary “one-piece” platform solution offers customers a cost-effective, flexible alternative to the current, inflexible "unit" (platform plus process modules) design that has been, until now, the only available choice.
With its innovative linear motion architecture and dual robot transport system that enables faster wafer transport, Intevac's Lean Platform offers significant advantages over alternative wafer transfer design as well as traditional cluster mainframes. With the Lean Platform, as technology changes, you can choose the most innovative, best-of-breed chip processing chambers and modules to meet new manufacturing requirements. Intevac's "universal" platform approach offers a highly flexible solution to help you meet the ongoing cost and productivity challenges presented by the ever-increasing pace of IC design.
For more information, email leanplatform@intevac.com.
