After revolutionizing magnetic media technology with lean process equipment, Intevac now introduces lean equipment to the semiconductor industry. Intevac's Lean Etch is the first ever wafer processing system designed using lean principles. The Lean Etch's unique architecture achieves improved results in throughput and uptime, optimizes clean room space, eases serviceability and dramatically reduces cost of ownership. The system's sophisticated process chamber technology offers advanced capabilities for dielectric etch applications. Intevac's lean equipment marks a milestone in the industry by introducing a new way of thinking when it comes to designing and manufacturing capital equipment.
Intevac's lean semiconductor equipment is the result of years of dedicated effort by an experienced engineering and management team.
As the market leader in magnetic media deposition technology, Intevac has consistently brought cutting-edge innovation to market and has played an integral role in the industry’s evolution. Disk drive manufacturers worldwide use Intevac media deposition equipment and over 40 million disks are processed every month on Intevac systems. The MDP-250B system enjoys the highest install base. The 200 Lean® was the first to successfully equip hard disk drive manufacturers with next generation perpendicular processing technology. Approximately 120 MDP-250B tools have been shipped so far. We expect the 200 Lean will supercede the MDP-250B in terms of install base by 2008. The 200 Lean is also extendible to next generation perpendicular, patterned media and heat assisted magnetic recording technologies.
Intevac introduced the concept of design modularity in capital equipment making systems much more flexible and adaptable for future technologies. Linear systems designed by Intevac marked a significant strategic shift from the old-line cluster tools. Linear systems have resulted in higher process and space utilization, smaller footprint and lower total cost of ownership.
